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Press Release

November 7, 2012

Viasystems Announces Third Quarter 2012 Results

ST. LOUIS--(BUSINESS WIRE)-- Viasystems Group, Inc. (NASDAQ:VIAS), a leading provider of complex multi-layer printed circuit boards and electro-mechanical solutions, today announced results for the third quarter ended September 30, 2012.

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Viasystems Group, Inc., headquartered in St. Louis, Missouri, is a leading worldwide provider of complex multi-layer printed circuit boards (PCBs) and Electro-Mechanical Solutions to OEMs. Viasystems has the ability globally to support the customer’s full product life cycle from quick-turnaround PCBs for new product introduction to high-volume, low-cost fabrication of complex boards – combined with comprehensive sourcing, assembly, and metal fabrication capabilities to supply everything from subassemblies to finished electronic products.

We provide advanced-technology printed circuit boards, large format backplanes and assemblies, custom sheet metal and enclosures, cabinets, racks and subracks, and electro-mechanical assemblies all the way through Level 5 Integration. Industry leaders in automotive technology, telecommunications, computer storage systems, and industrial, medical and aerospace equipment trust Viasystems to provide the technology, quality and service they require. Our technical support centers around the globe provide local engineering support and assist customers in launching new products.